High-frequency circuit package

Details High-frequency circuit package High-frequency circuit package

1991-01-16

1993-08-24

Picard, Leo P.

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

174 65R, 174262, 361774, 361777, 361818, H05K 900, H02G 318

Patent

active

052391264

ABSTRACT:
A high-frequency circuit package including a conductive substrate, and upper and lower shielding cases which come tightly into contact with opposite surfaces of the conductive substrate to define therein upper and lower shielding chambers. High-frequency circuits are mounted on the surfaces of the conductive substrate within the upper and lower chambers, respectively.

REFERENCES:
patent: 4658334 (1987-04-01), McSparran et al.
patent: 5014160 (1991-05-01), McCoy, Jr.

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