High frequency circuit device

Wave transmission lines and networks – Long lines – Strip type

Patent

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Details

29600, 156291, 228123, H01P 308

Patent

active

045688966

ABSTRACT:
An improvement in a high-frequency circuit device wherein a dielectric substrate made of ceramic is provided at its top side with a high-frequency circuit and at its bottom side with a conductive film and wherein the substrate is joined to a grounding conductor of metallic material by means of solder or conductive bonding agent. In joining the conductive film to the grounding conductor, the solder or the conductive bonding agent is applied not to the entire surface of the conductive film but to a part of the film surface, i.e., only to a square, equilateral N-gon (where N is an even number) or circular region almost at the center of the entire film surface, whereby the substrate can be prevented from cracking in its heating and cooling processes.

REFERENCES:
patent: 4218664 (1980-08-01), Assal et al.

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