Wave transmission lines and networks – Long lines – Strip type
Reexamination Certificate
2006-01-10
2006-01-10
Jones, Stephen E. (Department: 2817)
Wave transmission lines and networks
Long lines
Strip type
C333S246000, C333S034000, C333S02200F
Reexamination Certificate
active
06985056
ABSTRACT:
A high-frequency circuit formed on a surface of a dielectric substrate includes: a signal strip formed on a first face of the dielectric substrate for transmitting a signal therethrough; a pair of ground strips formed on the first face astride the signal strip, with an interspace on each side of the signal strip; a ground conductor layer formed on a second face of the dielectric substrate, the second face being opposite to the first face; and a plurality of through-vias formed in the dielectric substrate astride the signal strip for electrically connecting the pair of ground strips to the ground conductor layer. First and second through-vias, which are a pair of opposing through-vias located closest to a terminating end of the signal strip, are disposed apart from each other by a distance smaller than a distance between any other pair of opposing through-vias.
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M. Ito et al., “Analysis of Millimeter-wave Packaging Structure Using Electromagnetic Simulator and Its Application to W-band Package”, technical report of The Institute of Electronics, Information and Communication Engineers, ED2000-154, MW2000-107 (Sep. 2000), pp. 55-60.
Jones Stephen E.
Matsushita Electric - Industrial Co., Ltd.
Wenderoth , Lind & Ponack, L.L.P.
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