High-frequency bonding apparatus

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...

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219 1069, 219 1081, B32B 1902, H05B 904

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active

040090680

ABSTRACT:
A rotating platform carries circumferentially spaced presses having bonding electrodes. A pair of stationary inductors, preferably arcuate plates, are connected to a high frequency generator. The electrodes of respective presses are connected to respective pairs of movable inductors which overlap the stationary inductors successively as the presses pass thereby, and provide capacitive couplings to supply high frequency energy to the presses successively to bond the material held by the presses. The overlapping portions of the fixed and movable inductors are of different circumferential length which, together with the rotation, controls the length of the bonding periods and automatically switches the bonding current from one press to the next. Odd numbers of overlapping plates for the capacitive couplings are provided, particularly three plates. The movable inductors are advantageously attached to the jaws of the presses.

REFERENCES:
patent: 2903041 (1959-09-01), Jones et al.
patent: 3006801 (1961-10-01), Pfeffer
patent: 3357108 (1967-12-01), Bennett

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