High frequency balun provided in a multilayer substrate

Details High frequency balun provided in a multilayer substrate High frequency balun provided in a multilayer substrate

1996-03-05

1997-07-01

Gensler, Paul

Wave transmission lines and networks

Coupling networks

Balanced to unbalanced circuits

333238, H01P 510

Patent

active

056442726

ABSTRACT:
Baluns according to the present invention use both distributed and discrete elements connected together in a multilayer dielectric structure. As distributed elements, coupled striplines are provided in the multilayer dielectric structure. The discrete components are placed on the surface of the multilayer structure and connected with the distributed elements through via-holes. The operating frequency of the balun can be changed by changing values of the discrete components without changing the multilayer structure itself.

REFERENCES:
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patent: 4651344 (1987-03-01), Hasegawa et al.
patent: 4758922 (1988-07-01), Ishigaki et al.
patent: 4954790 (1990-09-01), Barber
patent: 5015972 (1991-05-01), Cygan et al.
patent: 5025232 (1991-06-01), Pavio
patent: 5150088 (1992-09-01), Virga et al.
patent: 5451914 (1995-09-01), Stengel

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