High frequency antenna disposed on the surface of a three...

Communications: radio wave antennas – Antennas – With coupling network or impedance in the leadin

Reexamination Certificate

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Details

C333S246000, C333S247000, C257S664000, C174S266000

Reexamination Certificate

active

07015869

ABSTRACT:
The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a dielectric. The electrical device is preferably of the sort needed to conduct high frequency communications, such as a microwave antenna and photonic receivers and transmitters. The electrical devices are attached to the substrate at the connection points described by the intersection of a series vias and one of the substrate surfaces. The electrical devices are attached to the substrate in numerous ways, including solder, flipped chip ball bonds, wire bonds, or a gold stud assembly. In particular, the gold stud assembly is utilized to attach the antenna to the substrate, thereby providing a predetermined air gap therebetween.

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patent: WO 01/41517 (2001-06-01), None

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