Wave transmission lines and networks – Long line elements and components – Connectors and interconnections
Reexamination Certificate
2010-06-21
2011-11-15
Jones, Stephen (Department: 2817)
Wave transmission lines and networks
Long line elements and components
Connectors and interconnections
C333S033000
Reexamination Certificate
active
08058956
ABSTRACT:
A high frequency and wide band impedance matching via is provided, applicable to multi-layer printed circuit boards, for example. The multi-layer circuit board may include several signal transmission traces, several ground layers, signal transmission vias and ground vias. The signal transmission traces and the ground layers may be sited on different circuit layers, and each signal transmission trace may be opposite to one of the ground layers. The signal transmission vias may be connected between the signal transmission traces. The ground vias may be connected between the ground layers. The ground vias may be opposite to the signal transmission vias, and the ground vias corresponding to the signal transmission vias may be sited to stabilize the characteristic impedance of the transmission traces.
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Chinese Office Action dated Oct. 10, 2008.
Chinese Office Action dated Mar. 28, 2008.
Chen Chang-Sheng
Jow Uei-Ming
Lai Ying-Jiunn
Weng Ching-Liang
Industrial Technology Research Institute
Jones Stephen
Morris Manning & Martin LLP
Tingkang Xia, Esq. Tim
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