High force flexible lead bonding apparatus

Details High force flexible lead bonding apparatus High force flexible lead bonding apparatus

1976-03-24

1977-03-22

Smith, Al Lawrence

Metal fusion bonding

Including means to force or clamp work portions together...

Work portion comprises electrical component

228 6A, H01L 21603

Patent

active

040132099

ABSTRACT:
An apparatus for bonding the flexible leads of a printed circuit pattern to the terminal pads of an integrated circuit device includes means for positioning the flexible leads juxtapose the terminal pads on the semiconductor device, means for rapidly positioning a thermode opposite said juxtapose flexible leads and terminal pads, means for applying a low force to said thermode and means for subsequently applying a high force to said thermode which comprises a horizontally reciprocating and vertically actuated pivoted thermode support lever.

REFERENCES:
patent: 3442432 (1969-05-01), Santangini
patent: 3543988 (1970-12-01), Kulicke
patent: 3695501 (1972-10-01), Radobenko

Affiliated with

Also associated with

Rating

High force flexible lead bonding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High force flexible lead bonding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High force flexible lead bonding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1952359