Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Patent
1993-08-25
1994-11-29
Heinrich, Samuel M.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Plural discrete workpieces
228 447, 228 495, H01L 21603
Patent
active
053682173
ABSTRACT:
A high force flip chip bonding method and system that precisely and forcefully engage a flip chip device with a corresponding wiring pattern on a substrate in a manner that prevents flip chip device and substrate shifting during force application. The method includes the steps of determining the centroid of the pattern formed by the interconnects on the flip chip device. The flip chip device is directed toward the substrate for contacting the corresponding wiring pattern with the interconnects and then the interconnects are compressed into the corresponding wiring pattern using a bonding force. The bonding force is directed along a neutral axis of deflection that is coincident with the centroid. Applying the bonding force along the neutral axis of deflection at the centroid minimizes lateral shifting of the flip chip device relative to the substrate to precisely bond the interconnects to the corresponding wiring pattern.
REFERENCES:
patent: T955008 (1977-02-01), Gregor et al.
patent: 4670770 (1987-06-01), Tai
patent: 4749120 (1988-06-01), Hatada
patent: 4899921 (1990-02-01), Bendat et al.
patent: 4926241 (1990-05-01), Carey
patent: 4945954 (1990-07-01), Wehrly, Jr. et al.
patent: 4949148 (1990-08-01), Bartelink
patent: 5072874 (1991-12-01), Bertram et al.
patent: 5197650 (1993-03-01), Monzen et al.
patent: 5285946 (1994-02-01), Tomigashi et al.
Bertram Michael J.
Simmons Richard L.
Heinrich Samuel M.
Microelectronics and Computer Technology Corporation
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