High flow rate sampler for measuring emissions at process compon

Measuring and testing – With fluid pressure – Leakage

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

7386333, G01M 318

Patent

active

055633358

ABSTRACT:
A new high flow rate sampling device and methods for measuring fugitive gas emissions are provided. The high flow rate sampler comprises an air mover connected to a flexible hose for drawing in air near a process component, such as a pump, compressor seal, flange, or pipe thread connection. A second sample hose draws air from the opposing side of the process component at a flow rate low enough not to affect capture of the leak by the first sample hose. Air measured from the first sample hose will contain fugitive emissions from the process component being measured, as well as from other process components. Air measured from the second sample hose will contain only fugitive emissions from surrounding process components and can then be subtracted from the measurement from the first sample hose to obtain the leak rate from the process component in question.

REFERENCES:
patent: 3187558 (1965-06-01), Koncen et al.
patent: 3786675 (1974-01-01), Delatorre et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High flow rate sampler for measuring emissions at process compon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High flow rate sampler for measuring emissions at process compon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High flow rate sampler for measuring emissions at process compon will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-58862

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.