Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Patent
1996-05-24
2000-10-17
Morris, Terrell
Stock material or miscellaneous articles
All metal or with adjacent metals
Foil or filament smaller than 6 mils
428607, 428674, 428544, 205 50, 205291, C25D 104
Patent
active
061328871
ABSTRACT:
This invention relates to an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes. In one embodiment, the foil is annealed, said foil being characterized by a fatigue ductility of at least about 65%. The invention also relates to a process for making an electrodeposited copper foil using an electrolyte solution characterized by a critical concentration of chloride ions of up to about 5 ppm and organic additives of up to about 0.2 ppm.
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Apperson R. Duane
Bohmler Ulrike
Clouser Sidney J.
Schneider Bernd
Wiechmann Rudolf
Gould Electronics Inc.
Juska Clyde
Morris Terrell
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