Metal working – Barrier layer or semiconductor device making – Barrier layer device making
Reexamination Certificate
2011-07-12
2011-07-12
Garber, Charles D (Department: 2812)
Metal working
Barrier layer or semiconductor device making
Barrier layer device making
Reexamination Certificate
active
07976587
ABSTRACT:
The invention is directed to a carbon composition produced from a carbon precursor, a carbon precursor modifier, and an additive, wherein a mixture of the recited components is formed, the carbon precursor is cured, the resulting mixture carbonized to produce a porous carbon composition. Also disclosed are methods for preparing the carbon composition and for using the carbon composition to fabricate electrodes and electric double layer capacitors comprising the carbon composition.
REFERENCES:
patent: 6201685 (2001-03-01), Jerabek et al.
patent: 6212062 (2001-04-01), Day et al.
patent: 6225733 (2001-05-01), Gadkaree et al.
patent: 6304426 (2001-10-01), Wei et al.
patent: 6487066 (2002-11-01), Niiori et al.
patent: 6565701 (2003-05-01), Jerabek et al.
patent: 6565763 (2003-05-01), Asakawa et al.
patent: 6714391 (2004-03-01), Wilk et al.
patent: 6738252 (2004-05-01), Okamura et al.
patent: 2004/0085710 (2004-05-01), Takeuchi et al.
patent: 2005/0169829 (2005-08-01), Dai et al.
patent: 4-175277 (1992-06-01), None
patent: 5-21274 (1993-01-01), None
patent: 1-196807 (1999-08-01), None
patent: 2005-235918 (2005-09-01), None
patent: 2007-91511 (2007-04-01), None
patent: 2003-0033789 (2003-05-01), None
Gadkaree Kishor Purushottam
Mach Joseph Frank
Corning Incorporated
Garber Charles D
Nikmanesh Seahvosh J
Russell Michael W.
LandOfFree
High energy density ultracapacitor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High energy density ultracapacitor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High energy density ultracapacitor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2713505