High electron mobility transistor (HEMT) structure with...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

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C257S280000, C257S282000, C257S283000, C438S570000

Reexamination Certificate

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07411226

ABSTRACT:
An InP high electron mobility transistor (HEMT) structure in which a gate metal stack includes an additional thin layer of a refractory metal, such as molybdenum (Mo) or platinum (Pt) at a junction between the gate metal stack and a Schottky barrier layer in the HEMT structure. The refractory metal layer reduces or eliminates long-term degradation of the Schottky junction between the gate metal and the barrier layer, thereby dramatically improving long-term reliability of InP HEMTs, but without sacrifice in HEMT performance, whether used as a discrete device or in an integrated circuit.

REFERENCES:
patent: 5359220 (1994-10-01), Larson et al.
patent: 6020226 (2000-02-01), Cerny et al.
patent: 6555850 (2003-04-01), Sakamoto et al.
patent: 6787826 (2004-09-01), Tserng et al.
patent: 2002/0030202 (2002-03-01), Liu et al.

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