High electrical performance semiconductor package

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C174S261000

Reexamination Certificate

active

10974376

ABSTRACT:
A high electrical performance semiconductor package is proposed. A carrier is provided having a first surface, an opposite second surface, and conductive vias for electrically connecting the first surface to the second surface. A chip is attached to the first surface of the carrier. A plurality of via lands are disposed peripherally on the first surface of the carrier and electrically connected to the vias. A plurality of conductive regions are disposed on the second surface of the carrier and electrically connected to the vias. A plurality of fingers are disposed around the chip and electrically connected to the via lands by conductive traces formed on the first surface of the carrier. A plurality of bonding wires electrically connect the chip to the fingers. Lengths of the wires for transmitting differential pair signals are substantially equal, and lengths of the traces for transmitting the differential pair signals are substantially equal.

REFERENCES:
patent: 5153385 (1992-10-01), Juskey et al.
patent: 5942794 (1999-08-01), Okumura et al.
patent: 6081029 (2000-06-01), Yamaguchi
patent: 6191477 (2001-02-01), Hashemi
patent: 6225146 (2001-05-01), Yamaguchi et al.
patent: 6229200 (2001-05-01), Mclellan et al.
patent: 6235997 (2001-05-01), Asada et al.
patent: 6281047 (2001-08-01), Wu et al.
patent: 6384726 (2002-05-01), Epple et al.
patent: 6462423 (2002-10-01), Akram et al.

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