High efficiency semiconductor wafer coating apparatus and method

Details High efficiency semiconductor wafer coating apparatus and method High efficiency semiconductor wafer coating apparatus and method

1998-02-24

2000-01-25

Bell, Janyce

Coating processes

Centrifugal force utilized

427 10, 4273855, 118 52, 118713, 437231, B05D 312, B05C 1102

Patent

active

060175850

ABSTRACT:
A wafer coating apparatus for use in the application of a viscous precursor fluid on a substrate surface of a silicon substrate. The coating apparatus includes a carrier mechanism adapted to support the substrate thereon; and a coating head having a deposition surface positioned proximate and substantially parallel to the substrate surface. The deposition surface defines at least one orifice in flow communication with the precursor fluid for deposition thereof between the substrate surface and the deposition surface. The coating apparatus further includes a rotating device coupled to at least one of the coating head and the carrier mechanism for relative rotational movement between the deposition surface and the substrate surface about a rotational axis to form a thin circular film coating on the substrate surface. A method of coating a silicon substrate surface of a substrate is also provided.

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