High efficiency plating apparatus and method

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Reexamination Certificate

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C204S22400M, C204S253000, C204S257000, C204S267000, C204S269000, C204S275100, C204S279000, C204S287000, C205S125000, C205S157000, C205S640000, C205S123000

Reexamination Certificate

active

10385999

ABSTRACT:
An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray having an open top which is configured to receive a horizontally-oriented workpiece, with the tray having a top edge with a portion of the edge forming a dam over which the solution may flow and an opening in its lower portion where the solution can enter the tray, (2) a reservoir tank situated below the tray, (3) a feed line connecting the reservoir tank and tray opening, (4) a drain that returns the solution that overflows the tray top edge to the reservoir tank, and (5) a pump that circulates the solution from the tank to the tray and over the horizontally situated workpiece.

REFERENCES:
patent: 3710058 (1973-01-01), Harden, Jr.
patent: 4401522 (1983-08-01), Buschow et al.
patent: 4539090 (1985-09-01), Francis
patent: 4889584 (1989-12-01), Wada et al.
patent: 5417828 (1995-05-01), Sergio
patent: 5616230 (1997-04-01), Otsuka et al.
patent: 5658441 (1997-08-01), Spain et al.
patent: 5772765 (1998-06-01), Hosten
patent: 5827410 (1998-10-01), Hosten
patent: 5833816 (1998-11-01), Heermann et al.
patent: 6099702 (2000-08-01), Reid et al.
patent: 6126798 (2000-10-01), Reid et al.
patent: 6153064 (2000-11-01), Condra et al.
patent: 6165330 (2000-12-01), Ohba
patent: 6174417 (2001-01-01), Henington et al.
patent: 6261425 (2001-07-01), Huang et al.
patent: 6294060 (2001-09-01), Webb
patent: 6340422 (2002-01-01), DeVries
patent: 6368482 (2002-04-01), Oeftering et al.
patent: 6454258 (2002-09-01), Denys
patent: 6712081 (2004-03-01), Uehara et al.

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