Stock material or miscellaneous articles – Structurally defined web or sheet – Physical dimension specified
Patent
1997-11-25
2000-08-01
Copenheaver, Blaine
Stock material or miscellaneous articles
Structurally defined web or sheet
Physical dimension specified
428329, 428447, 524430, 524444, 442117, 442180, B32B 516
Patent
active
060964146
ABSTRACT:
A thermally-conductive, electrically insulative interface for conductively cooling a heat-generating source, such as an electronic component, having an associated thermal dissipation member such as a heat sink. The interface is provided as a cured sheet of a curable material formulated as a blend of a curable silicone binder, and a particulate alumina, i.e., aluminum oxide (Al.sub.2 O.sub.3), filler. The interface is observed to exhibit a thermal conductivity of at least about 0.8 W/m-K and a wet dielectric breakdown strength of at least about 475 Vac/mil.
REFERENCES:
patent: 4566990 (1986-01-01), Liu et al.
patent: 4596670 (1986-06-01), Liu et al.
patent: 4654754 (1987-03-01), Daszkowski
patent: 4842911 (1989-06-01), Fick
patent: 4869954 (1989-09-01), Squitieri
patent: 4979074 (1990-12-01), Morley et al.
patent: 5060114 (1991-10-01), Feinberg et al.
patent: 5137959 (1992-08-01), Block et al.
patent: 5151777 (1992-09-01), Akin et al.
patent: 5194480 (1993-03-01), Block et al.
patent: 5213868 (1993-05-01), Liberty et al.
patent: 5298791 (1994-03-01), Liberty et al .
patent: 5309320 (1994-05-01), Smith
patent: 5510174 (1996-04-01), Litman
patent: 5545473 (1996-08-01), Ameen et al.
Reynolds Alumina & Ceramics Laboratory, Analysis of RC-SPT DBM dated Sep., 1996.
General Electric Materials and Applications Resource Guide, (no date).
BFG Industries, Inc. Electronic Fabrics literature dated Sep., 1996.
Alcan Chemicals Product Data dated 1989, (no month).
Parker Seals, Cho-Therm Thermal Interface Materials dated 1993, (no month).
Copenheaver Blaine
Guarriello John J.
Molnar, Jr. John A.
Parker-Hannifin Corporation
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