High dielectric polymer composites and methods of...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Reexamination Certificate

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C524S397000, C524S403000, C528S092000, C528S411000

Reexamination Certificate

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06864306

ABSTRACT:
Polymer composites and methods of making the polymer composites are presented. A representative polymer composite includes a polymer resin and a conductive material, wherein the polymer composite is characterized by a dielectric constant greater the 200. A representative method of making the polymer composite can be broadly summarized by the following steps: providing a polymer resin and a conductive material; mixing the polymer resin and the conductive material; and forming the polymer composite, wherein the polymer composite is characterized by a dielectric constant greater than 200.

REFERENCES:
patent: 6544651 (2003-04-01), Wong et al.
Yang Rao and C.P. Wong; Material Characterization of High Dialectric Constant Polymer-Ceramic Composite for Embedded Capacitor to RF Application; 2002; Active Passive Eleactronic Compont v 25 n 1 2002; p. 123-129.
Yang Rao, C.P. Wong, and Jianmin Qu; Effective Dielectric Constant Prediction of Polymer-ceramic Composite Based on Self-consistent Theory; Dec. 2000; IEEE Transaction Compont Packaging Technology v 23 n 4 Dec. 2000; IEEE Piscatawy NJ USA; p. 680-683.
Yang Rao and C.P. Wong; Ultra High Dielectric Constant Epoxy Silver Composite for Embedded Capacitor Application; Submitted to Applied Polymer Science; p. 1-6.
Yang Rao and C.P. Wong; Novel Ultra-high Dielectric Constant Polymer Based Composite for Embedded Capacitor Application; Jun., 2002; Proceeding of ECTC, San Diego, CA; p. 196-200.
Yang Rao and C.P. Wong; Ultra High Dielectric Constant Epoxy Silver Composite for Embedded Capacitor Application; Jun., 2002; Proceeding of POLYTRONIC; p. 920-923.
Patent Application filed May 18, 2001, assigned Ser. No. 09/860,856 and published under No. US 2002/0016396A1 for inventor Wong, et al., entitled High Dielectric Constant Nan0-Structure Polymer-Ceremic Composite.

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