High dielectric layer-containing alumina-based wiring substrate

Details High dielectric layer-containing alumina-based wiring substrate High dielectric layer-containing alumina-based wiring substrate

1995-06-07

1996-05-28

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257700, H01L 2302

Patent

active

055213324

ABSTRACT:
A package for a semiconductor device comprising (i) a high dielectric layer composed of an alumina particles, a high permittivity-imparting agent in particles selected from (a) W or Mo, (b) Re and (c) zirconia and a glass plase comprising alumina and at least one component selected from silica, alkaline earth metal components, and rare earth device components present in their grain boundaries, (ii) a pair of electrode layers comprising as a main component a metal selected from W and Mo provided on both sides of the high dielectric layer, and (iii) insulation layers composed of alumina particles and a glass phase composed of alumina and at least one component selected from silica, alkaline earth metal components and rare earth device components, the insulation layers being provided so as to sandwich the electrode layers and the dielectric layer.

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