High dielectric constant flexible polyimide film and process of

Details High dielectric constant flexible polyimide film and process of High dielectric constant flexible polyimide film and process of

1999-05-14

2000-11-21

Nakarani, D. S.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

428325, 4284735, 524408, 524413, 524433, 524434, 524435, 524436, 524607, C08L 7908

Patent

active

061504564

ABSTRACT:
A flexible, high dielectric constant polyimide film composed of either a single layer of an adhesive thermoplastic polyimide film or a multilayer polyimide film having adhesive thermoplastic polyimide film layers bonded to one or both sides of the film and having dispersed in at least one of the polyimide layers from 4 to 85 weight % of a ferroelectric ceramic filler, such as barium titante or polyimide coated barium titanate, and having a dielectric constant of from 4 to 60. The high dielectric constant polyimide film can be used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors.

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patent: 5298331 (1994-03-01), Kanakarajan et al.
Patent Abstracts of Japan, vol. 095, No. 001, Feb. 28, 1995.
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Patent Abstracts of Japan, vol. 014, No. 497, Oct. 30, 1990.
Database WPI, Section Ch, Week 8041, Derwent Publications, Ltd, London, GB, Class A85, AN 80-72495C Aug. 29, 1980.

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