High density zero insertion force connector

Geometrical instruments

Patent

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Details

H01R 1338, H05K 112

Patent

active

044887663

ABSTRACT:
A high density circuit board edge connector having a very short electrical contact path is taught. Briefly stated, an insulative housing comprised of two parts have contained therein a cylindrical contact carrier being held in the housing by resiliently deformable spring steel members with the contact carrier having a series of slots therein by which a contact is fitted to. The contact is semi-circular in shape conforming to the configuration of the contact carrier. A camming device which is generally triangular in shape resides in one corner of the contact housing and through lateral movement parallel to the axis of the contact carrier urges the contact carrier and hence the contacts downwardly and outwardly while movement of the cam in the reverse lateral direction allows the spring steel members to urge the contact carrier and hence the contacts inwardly and upwardly. Disposed on the bottom wall of the housing are conductive posts which project through the housing and facilitate mounting of the assembly onto a mother circuit board. A daughter circuit board having conductive strips thereon is placed adjacent to the connector housing and upon lateral movement of the camming means the contact carrier having contacts contained thereon is urged downwardly and outwardly thereby in a wiping and contacting motion causes a portion of the contact to come in electrical communication with the conductive post and with the conductive strip, thereby providing electrical communication between the conductive strip of the daughter circuit board and the conductive post. The electrical path between the daughter board and the mother board through the contact is very short thereby minimizing inductive, capacitive and propagation delay effects. Additionally, the width of the contact is very small allowing large numbers of contacts to be placed closely next to each other thereby providing a very high density device.

REFERENCES:
patent: 3636499 (1972-01-01), Winklebleck
patent: 4077688 (1978-03-01), Cobaugh et al.
patent: 4165909 (1979-08-01), Yeager
patent: 4169644 (1979-10-01), Bonhomme
patent: 4186982 (1980-02-01), Cobaugh et al.
patent: 4189200 (1980-02-01), Yeager et al.
patent: 4355856 (1982-10-01), Porter
IBM Disclosure Bulletin, vol. 10, No. 9, Feb. 1968, Connector.

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