High density, zero-height, free floating interconnect system

Details High density, zero-height, free floating interconnect system High density, zero-height, free floating interconnect system

2007-09-18

2007-09-18

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

With signal, scale, illuminator, or optical viewer

C029S720000, C029S759000, C029S760000, C029S852000, C029S876000

Reexamination Certificate

active

10726927

ABSTRACT:
A system provides a zero interconnection height in a board-to-board interconnect while maintaining efficient space allocation for multiple axis connections by providing a floating connection in one plane thereby enabling a connection in another plane. A first circuit board having a first plurality of through-holes is aligned with a second circuit board having a second plurality of through-holes so that the first plurality of through-holes is matched with the second plurality of through-holes. An interconnection height of zero is provided between the first circuit board and the second circuit board. At least one pass-through socket, which includes pass-through socket through-holes, is aligned with the combination of the first circuit board and second circuit board. One or more pins disposed on a pin header are inserted through the pass-through socket, the first circuit board, and the second circuit board.

REFERENCES:
patent: 4911645 (1990-03-01), August et al.
patent: 5049084 (1991-09-01), Bakke
patent: 5219293 (1993-06-01), Imamura
patent: 6322382 (2001-11-01), Viallet
patent: 6698091 (2004-03-01), Heston et al.

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