High density woven wire harness assembly

Details High density woven wire harness assembly High density woven wire harness assembly

1989-08-08

1990-07-10

Pirlot, David

Electrical connectors

Including or for use with tape cable

With mating connection region formed by bared cable

439 77, 439493, 29850, 174117F, H01R 907

Patent

active

049404261

ABSTRACT:
A high density electrical connector assembly, and method of manufacturing same. More particularly, the invention covers an essentially flat, woven screen formed of a plurality of substantially parallel, electrically conductive wires forming the warp wires thereof, where such wires may be as small as 2 mils in diameter. Arranged essentially perpendicular thereto are plural, spaced apart, insulative woof filaments. To one major face of said flat, woven screen is applied a hot laminating film to encapsulate said wires, while to such other major face a comparable film is applied. However, for such other face, the encapsulating film is not coextensive with the screen length, but rather is spaced from the ends thereof so as to provide for connector contacts on each such wire. If desirable, the contacts may be plated.
The invention also contemplates means for electrically interconnecting the assembly hereof to a high density circuit pattern, such as found on a PC board.

REFERENCES:
patent: 1012030 (1911-12-01), Underwood
patent: 4470195 (1984-09-01), Lang
patent: 4518648 (1985-05-01), Miyata et al.
patent: 4616717 (1986-10-01), Luetzow
patent: 4651163 (1987-03-01), Suteron et al.
patent: 4741107 (1988-05-01), Mondor, III
patent: 4755422 (1988-07-01), Headrick et al.

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