High-density wiring multilayered substrate

Details High-density wiring multilayered substrate High-density wiring multilayered substrate

1987-12-10

1989-10-03

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428432, 428433, 428689, 428702, 428901, 106 113, 106 114, 106 118, 106 119, 106 125, 252512, 252518, 252520, B32B 900

Patent

active

048716081

ABSTRACT:
A high-density wiring multi-layered substrate comprising a plurality of sequentially laminated green sheets containing crystallizable glass, each of the green sheets having a conductor paste on the surface thereof, the conductive component of the conductor paste comprising at least about 80 wt % of one copper component selected from copper and copper oxide and at least one member selected from up to about 15 parts by weight of MnO.sub.2 and up to about 10 parts by weight of Ag.sub.2 O based on 100 parts by weight of said copper component in terms of metallic copper.

REFERENCES:
patent: 2720573 (1955-10-01), Lundqvist
patent: 3324049 (1967-06-01), Holmes
patent: 3450545 (1969-06-01), Ballard et al.
patent: 3502489 (1970-03-01), Cole
patent: 3681135 (1972-08-01), Cheary
patent: 3776769 (1973-12-01), Buck et al.
patent: 3896055 (1975-07-01), Bouchard et al.
patent: 4001146 (1977-01-01), Horowitz
patent: 4670189 (1987-06-01), Tomibe et al.
patent: 4678505 (1987-07-01), Bushey
patent: 4687597 (1987-08-01), Siuta
Hackh's Chem. Dictionary, pp. 1219-1220, 4th Ed., Julius Grant.

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