High density wired module

Details High density wired module High density wired module

1984-06-29

1985-08-13

Tolin, G. P.

Electricity: electrical systems and devices

Miscellaneous

361410, 339 18C, H05K 108

Patent

active

045353883

ABSTRACT:
The wiring nets on a module are divided into two groups of planes, i.e., an upper group in which wiring is placed along "north-south" and "east-west" directions and a lower group in which wiring is placed along diagonal directions. All vias for connecting to the wiring pass through the upper group of planes but only half of the vias pass through the lower group of planes. Thus the spacing between the vias of the lower group of planes is greater than the spacing between the upper vias, allowing more lines per wiring channel in the lower group of planes.

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IBM Tech. Discl. Bull., vol. 21, No. 3, Aug. 1978, "Via Placement . . . Substrates", Melvin, p. 1021.
IBM TDB, vol. 14, No. 4, Sep. 1971, pp. 1316-1317.
IBM TDB, vol. 24, No. 1B, Jun. 1981, pp. 730-731.

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