High density three-dimensional RF / microwave switch...

Details High density three-dimensional RF / microwave switch... High density three-dimensional RF / microwave switch...

2007-12-11

2007-12-11

Takaoka, Dean (Department: 2817)

Wave transmission lines and networks

Plural channel systems

Having branched circuits

C333S262000

Reexamination Certificate

active

11284293

ABSTRACT:
RF switching system (100, 200) formed from a structure (102, 202) comprised of dielectric material. The structure can have two or more faces (104, 204), with at least one face located in a plane exclusive of at least a second one of the faces. For example, the structure can define a geometric shape that is a polyhedron. RF switches (106, 206) can be disposed on two or more of the faces. Conductive RF feed stubs (110, 210) are provided for each RF switch extending from an interconnection point (114, 214) to electrical contact terminals (116, 216) that are respectively connected to the RF switches. The interconnection point is located within the structure at a location generally medial to the two or more of terminals.

REFERENCES:
patent: 3260967 (1966-07-01), Tilman et al.
patent: 5936482 (1999-08-01), Ando et al.
patent: 6876056 (2005-04-01), Tilmans et al.
patent: 2004/0095205 (2004-05-01), Schaffner et al.
patent: 2004/0155725 (2004-08-01), Kwaitkowski
patent: 2005/0068129 (2005-03-01), Denatale et al.

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