High-density, three-dimensional, intercoupled circuit structure

Details High-density, three-dimensional, intercoupled circuit structure High-density, three-dimensional, intercoupled circuit structure

1997-06-16

1998-06-16

Mengistu, Amare

Computer graphics processing and selective visual display system

Plural physical display element control system

Display elements arranged in matrix

345 76, G09G 320

Patent

active

057678243

ABSTRACT:
A three-dimensional circuit structure includes a plurality of elongate cylindrical substrates positioned in parallel and in contact with one another. Electrical components are formed on the surfaces of the substrates, along with electrical conductors coupled to those components. The conductors are selectively positioned on each substrate so as to contact conductors on adjacent substrates to allow for the transfer of electrical signals between substrates. The conductor patterns on the substrates may be helical, circumferential, or longitudinal, in such a fashion that substrates may be added to or removed from the bundle so that the bundle will continue to operate as needed. The cylindrical nature of the substrates leaves gaps or channels between the substrates to which cooling fluid may be supplied for cooling the circuitry.

REFERENCES:
patent: 1595735 (1926-08-01), Schmierer
patent: 2138197 (1938-11-01), Pressler et al.
patent: 2998541 (1961-08-01), Kuntz et al.
patent: 3013182 (1961-12-01), Russell
patent: 3187320 (1965-06-01), Kupsky
patent: 3512041 (1970-05-01), Dalmasso
patent: 3548254 (1970-12-01), Pablavan
patent: 3701123 (1972-10-01), Barrett et al.
patent: 3786307 (1974-01-01), Robinson
patent: 3947722 (1976-03-01), Strom et al.
patent: 5087610 (1992-02-01), Hed

Affiliated with

Also associated with

Rating

High-density, three-dimensional, intercoupled circuit structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-density, three-dimensional, intercoupled circuit structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-density, three-dimensional, intercoupled circuit structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1730924