High density, three-dimensional, intercoupled circuit structure

Details High density, three-dimensional, intercoupled circuit structure High density, three-dimensional, intercoupled circuit structure

1992-04-21

1993-12-14

Nimmo, Morris H.

Electricity: conductors and insulators

With fluids or vacuum

With cooling or fluid feeding, circulating or distributing

174252, 174260, 361689, H05K 720

Patent

active

052704858

ABSTRACT:
A three-dimensional circuit structure includes a plurality of elongate cylindrical substrates positioned in parallel and in contact with one another. Electrical components are formed on the surfaces of the substrates, along with electrical conductors coupled to those components. The conductors are selectively positioned on each substrate so as to contact conductors on adjacent substrates to allow for the transfer of electrical signals between substrates. The conductor patterns on the substrates may be helical, circumferential, or longitudinal, in such a fashion that substrates may be added to or removed from the bundle so that the bundle will continue to operate as needed. The cylindrical nature of the substrates leaves gaps or channels between the substrates to which cooling fluid may be supplied for cooling the circuitry.

REFERENCES:
patent: 3401448 (1968-09-01), Iles et al.
patent: 3534467 (1970-10-01), Sachs et al.
patent: 3875479 (1975-04-01), Jaggar
patent: 3976508 (1976-08-01), Mlavsky
patent: 4020830 (1977-05-01), Johnson et al.
patent: 4884167 (1989-11-01), Mine
patent: 5016138 (1991-05-01), Woodman
patent: 5053856 (1991-10-01), Davidson
patent: 5106455 (1992-04-01), Jacobsen et al.
patent: 5124508 (1992-06-01), DuBrucy

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