High density, three-dimensional, intercoupled circuit structure

Details High density, three-dimensional, intercoupled circuit structure High density, three-dimensional, intercoupled circuit structure

1995-11-21

1997-03-11

Pascal, Leslie

Optical: systems and elements

Deflection using a moving element

Using a periodically moving element

34087031, 34087028, 455 41, H04B 1010

Patent

active

056107471

ABSTRACT:
A three-dimensional circuit structure includes a plurality of elongate cylindrical substrates positioned in parallel and in contact with one another. Electrical components are formed on the surfaces of the substrates, along with electrical conductors coupled to those components. The conductors are selectively positioned on each substrate so as to contact conductors on adjacent substrates to allow for the transfer of electrical signals between substrates. The conductor patterns on the substrates may be helical, circumferential, or longitudinal, in such a fashion that substrates may be added to or removed from the bundle so that the bundle will continue to operate as needed. The cylindrical nature of the substrates leaves gaps or channels between the substrates to which cooling fluid may be supplied for cooling the circuitry.

REFERENCES:
patent: 4601201 (1986-07-01), Oota
patent: 4837556 (1989-06-01), Matsushita
patent: 4962495 (1990-10-01), Gibbons
patent: 5237441 (1993-08-01), Nhu

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