Optical: systems and elements – Deflection using a moving element – Using a periodically moving element
Patent
1995-11-21
1997-03-11
Pascal, Leslie
Optical: systems and elements
Deflection using a moving element
Using a periodically moving element
34087031, 34087028, 455 41, H04B 1010
Patent
active
056107471
ABSTRACT:
A three-dimensional circuit structure includes a plurality of elongate cylindrical substrates positioned in parallel and in contact with one another. Electrical components are formed on the surfaces of the substrates, along with electrical conductors coupled to those components. The conductors are selectively positioned on each substrate so as to contact conductors on adjacent substrates to allow for the transfer of electrical signals between substrates. The conductor patterns on the substrates may be helical, circumferential, or longitudinal, in such a fashion that substrates may be added to or removed from the bundle so that the bundle will continue to operate as needed. The cylindrical nature of the substrates leaves gaps or channels between the substrates to which cooling fluid may be supplied for cooling the circuitry.
REFERENCES:
patent: 4601201 (1986-07-01), Oota
patent: 4837556 (1989-06-01), Matsushita
patent: 4962495 (1990-10-01), Gibbons
patent: 5237441 (1993-08-01), Nhu
Pascal Leslie
Sarcos Group
LandOfFree
High density, three-dimensional, intercoupled circuit structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High density, three-dimensional, intercoupled circuit structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density, three-dimensional, intercoupled circuit structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-447814