High density thick foil circuitry laminated package

Details High density thick foil circuitry laminated package High density thick foil circuitry laminated package

1976-07-28

1978-03-28

Klein, David

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29625, 156224, 156300, 156629, 156634, 156659, 264258, 264272, 264320, 428172, 428251, 428415, 428474, H05K 102, H05K 306

Patent

active

040816001

ABSTRACT:
Improvements are disclosed in the conventional process for the laminated packaging of etched circuitry consisting of:

REFERENCES:
patent: 2757443 (1956-08-01), Steigerwalt et al.
patent: 2964442 (1960-12-01), Hansen
patent: 2988839 (1961-06-01), Greenman et al.

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