High density test structure array to support addressable...

Details High density test structure array to support addressable... High density test structure array to support addressable...

2011-03-08

2011-03-08

Nguyen, Ha Tran T (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S762010

Reexamination Certificate

active

07902852

ABSTRACT:
Circuits for performing four terminal measurement point (TMP) testing of devices under test (DUT) is provided. The DUT and the circuit is to be defined on a semiconductor chip. The circuit includes a DUT having a first terminal and a second terminal, where the first terminal of the DUT is connectable to a first terminal measurement point and a third terminal measurement point, and the second terminal of the DUT is connectable to a second terminal measurement point and a fourth terminal measurement point. A first transistor is provided to select access to the first terminal measurement point, a second transistor is provided to select access to the third terminal measurement point, a third transistor is provided to select access to the second terminal measurement point; and a fourth transistor is provided to select access to the fourth terminal measurement point. In one example, the DUT is linked to neighboring DUTs, and selected ones of the first through fourth transistors are shared, thus reducing the number of transistors per DUT in a DUT bank, and reducing the area needed to implement DUT bank testing for addressable 4-TMP testing. The compact circuitry further enables DUT bank stacking in rows, addressing of columns of DUTs for conditional testing, and three dimensional stacking of DUT banks on different levels.

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