Electrical connectors – Including or for use with tape cable – With mating connection region formed by bared cable
Patent
1996-04-10
1997-09-09
Paumen, Gary F.
Electrical connectors
Including or for use with tape cable
With mating connection region formed by bared cable
439606, H01R 907
Patent
active
056649649
ABSTRACT:
A termination for a plurality of electrical conductors of a substrate includes a strain relief frame molded to the substrate, a connector housing having a plurality of electrical terminals positioned with respect to the frame to orient the terminals with respect to the conductors, and a plurality of the terminals being electrically connected to respective electrical conductors, the connections being made subsequent to the molding of the strain relief to the substrate. A cable termination assembly made by the process of molding a strain relief to a substrate having plural conductors in positional relation, said molding including leaving exposed connecting portions of respective conductors, subsequently attaching plural terminals respectively to exposed connecting portions of said conductors. A method of making a termination assembly includes molding a strain relief to a substrate having plural conductors in positional relation, said molding including leaving exposed connecting portions of respective conductors, subsequently attaching plural terminals respectively to exposed connecting portions of said conductors.
REFERENCES:
patent: 3961834 (1976-06-01), Venaleck et al.
patent: 4030799 (1977-06-01), Venaleck
patent: 4310218 (1982-01-01), Webster et al.
patent: 4547028 (1985-10-01), Morgan et al.
patent: 4639058 (1987-01-01), Morgan
patent: 4679870 (1987-07-01), Pretchel
patent: 4793060 (1988-12-01), Pretchel
patent: 4798544 (1989-01-01), Hartman
patent: 4863402 (1989-09-01), Balck et al.
patent: 4880388 (1989-11-01), Beamenderfer et al.
Crofoot Larry M.
Roath Alan L.
Ohio Associated Enterprises, Inc.
Paumen Gary F.
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