High density tape-automated bonding (TAB) of electronic componen

Details High density tape-automated bonding (TAB) of electronic componen High density tape-automated bonding (TAB) of electronic componen

1989-08-24

1990-02-06

Evans, Arthur G.

Recorders

Electric recording

Electrochemical

346160, G01D 1500

Patent

active

048991856

ABSTRACT:
A plurality of narrowly spaced electrodes of an electronic device are connected to a corresponding plurality of similarly spaced electrodes of another electronic device by two superimposed mutually separated layers of wires. The lower wires of the lower layer are bonded to outer bonding pads of alternate device electrodes that are located in a first row near the corresponding edges of the respective devices. Inner bonding pads of the other device electrodes are located in a second row further from the corresponding device edges between the outer pad electrodes and are bonded to the wires of the upper layer, the connecting ends of which extend beyond the corresponding ends of the lower wires.

REFERENCES:
patent: 4797895 (1989-01-01), Kokubo et al.
patent: 4803565 (1989-02-01), Teshigawara et al.

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