Patent
1987-03-02
1989-02-21
James, Andrew J.
357 71, 357 54, 357 32, 357 40, 357 24, H01L 2714
Patent
active
048070009
ABSTRACT:
A high density optical detector mosaic array assembly having a plurality of interconnect locations comprised of IC readout pads in a pattern suitable for interconnecting a plurality of integrated circuit devices. The assembly comprises a substrate, a plurality of thin film metallization layers alternating with a plurality of thick film dielectric layers wherein the first of the thin film layers is deposited directly on the substrate and is delineated to form a plurality of interconnect lines disposed in a pattern suitable to form a first row of the dectector mosaic at a first edge of the assembly and terminating at an interconnect location. Terminal pads are applied to each such interconnect line and the first thick film dielectric layer is deposited over the thin film interconnect line such that only the terminal pads are left exposed. Each alternating layer of thick film and thin film layers are similarly disposed to form a complete interconnect pattern suitable for interconnecting with the integrated circuit devices and a plurality of detector rows forming the detector mosaic interconnect lines. Bonding pads are applied to the detector mosaic such that the fill factor for detectors is about 100% for bonding pads on centers in the range of about 25 micrometers.
REFERENCES:
patent: 4286278 (1981-08-01), Lorenze, Jr. et al.
patent: 4566024 (1986-01-01), Fleury et al.
patent: 4695861 (1987-09-01), Paine et al.
patent: 4737833 (1988-04-01), Tabei
Gurnee Mark N.
White William J.
Honeywell Inc.
James Andrew J.
Mintel William A.
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