High density semiconductor package

Details High density semiconductor package High density semiconductor package

2005-09-27

2005-09-27

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S678000

Reexamination Certificate

active

06949826

ABSTRACT:
A high density semiconductor package comprises a substrate, a first package module and a plurality of second package modules. The substrate has a surface on which the first package module and the second package modules are disposed, wherein the second package modules surround the first package module.

REFERENCES:
patent: 5856937 (1999-01-01), Chu et al.
patent: 5990564 (1999-11-01), Degani et al.
patent: 6475830 (2002-11-01), Brillhart
patent: 6610560 (2003-08-01), Pu et al.
patent: 6696765 (2004-02-01), Kazama et al.
patent: 6732304 (2004-05-01), Ong

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