High density semiconductor package

Electricity: conductors and insulators – Boxes and housings – With electrical device

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Details

257666, 257723, 257735, H01L 2302

Patent

active

054830249

ABSTRACT:
The invention discloses a high density semiconductor package. In one embodiment, two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.

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patent: 5296737 (1994-03-01), Nishimura et al.
patent: 5327325 (1994-07-01), Nicewarner, Jr.
patent: 5331235 (1994-07-01), Chun

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