High density semiconductor package

Details High density semiconductor package High density semiconductor package

1995-06-07

1997-06-10

Ledynh, Bot L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257787, 257723, H01L 2328

Patent

active

056378289

ABSTRACT:
The invention discloses a high density semiconductor package. Two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.

REFERENCES:
patent: 4975763 (1990-12-01), Baudouin
patent: 5014112 (1991-05-01), Gelsomini
patent: 5327325 (1994-07-01), Nicewarner, Jr.
patent: 5331235 (1994-07-01), Chun

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