High density semiconductor memory module using split finger lead

Details High density semiconductor memory module using split finger lead High density semiconductor memory module using split finger lead

1990-07-17

1993-07-13

Dixon, Joseph L.

Static information storage and retrieval

Interconnection arrangements

257666, 257670, 257676, 361421, G11C 506, H01L 23495, H01L 2350, H05K 502

Patent

active

052279952

ABSTRACT:
The semiconductor memory module comprises a housing of plastic or ceramic in which two chips are stacked together back-to-back. The pads of the chips are electrically connected by wire bonding to beam leads which comprise outer bond leads, generally arranged outside the housing to form the contact pins or contact leads of the module to a printed circuit board, and inner bond leads in the housing. The inner bond leads are split and spread in the area of the inner lead bond ends into upper and lower sets forming a gap for receiving and holding the stacked chips.

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