Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2011-04-26
2011-04-26
Hammond, Briggitte R (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S607070
Reexamination Certificate
active
07931474
ABSTRACT:
A high speed connector includes a plurality of wafer-style components, the wafers including two columns of conductive terminals that are supported in an insulative support body by a plurality of channels. Ribs may be provided to help secure one of the terminals in one of the plurality of channels. The two columns of terminals are configured to form broadside coupled terminal pairs and an air channel is at least partially disposed in the wafer between two adjacent broadside coupled terminal pairs.
REFERENCES:
patent: 6083047 (2000-07-01), Paagman
patent: 6979202 (2005-12-01), Benham et al.
patent: 7335063 (2008-02-01), Cohen et al.
patent: 7553190 (2009-06-01), Laurx et al.
patent: 7731537 (2010-06-01), Amleshi et al.
patent: 2007/0021003 (2007-01-01), Laurx et al.
Amleshi Peerouz
Dunham David E.
Laurx John C.
Hammond Briggitte R
Molex Incorporated
Sheldon Stephen L.
Tsukerman Larisa Z
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