High-density programmable logic device in a multi-chip module pa

Details High-density programmable logic device in a multi-chip module pa High-density programmable logic device in a multi-chip module pa

1995-02-23

1997-06-24

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174261, 257786, 257723, 257724, 361760, 361777, H05K 702, H05K 116

Patent

active

056422628

ABSTRACT:
A high performance single package multi-chip module multiplies the logic density of the highest density monolithic programmable logic device (PLD). A dual-sided substrate carries multiple prepackaged PLDs on a top side and a field programmable interconnect (FPIC) die on a bottom side. The input/output terminals of the PLDs are interconnected with the FPIC die in a scrambled fashion to reduce signal skew.

REFERENCES:
patent: 4630096 (1986-12-01), Drye et al.
patent: 4996630 (1991-02-01), Liguori et al.
patent: 5089936 (1992-02-01), Kojima et al.
patent: 5137836 (1992-08-01), Lam
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5378981 (1995-01-01), Higgins, III
patent: 5396403 (1995-03-01), Patel
patent: 5399505 (1995-03-01), Dasse et al.
patent: 5444296 (1995-08-01), Kaul et al.
patent: 5444298 (1995-08-01), Schutz
patent: 5509203 (1996-04-01), Yamashita
Dave Bursky, "CPLD Module Packs 50k Usable Gates, 360 I/O Pins," brochure from Altera Corporation reprinted from Electronic Design, Apr. 4, 1994, 4 pp.
IBM Technical Disclosure Bulletin "Error Detection And Fault Isolation Packaging For Circuit Chips" vol. 30 No. 9 pp. 1 and 2, Feb. 1988.

Affiliated with

Also associated with

Rating

High-density programmable logic device in a multi-chip module pa does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-density programmable logic device in a multi-chip module pa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-density programmable logic device in a multi-chip module pa will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-152591