High density probe head for chip testing

Details High density probe head for chip testing High density probe head for chip testing

1988-01-13

1989-08-01

Tarcza, Thomas H.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

G01R 106

Patent

active

H00006637

ABSTRACT:
A probe head of substantially rectangular construction for use in the testing of chips. The probe head has a body disposed about the perimeter of a substantially transparent fused silica window, probe points extending in a high-density fixed configuration through the fused silica window, and probe leads at one end of which the probe points are formed. The probe leads are disposed in a plurality of layers, such that interior surface, as well as perimeter, probing and testing of chips is facilitated. The probe head also includes a depth-limit plate extending over the edge of the fused silica window and connecting to the probe head body.

REFERENCES:
patent: 3911361 (1975-10-01), Bove et al.
patent: 4544886 (1985-10-01), Murray et al.
patent: 4544888 (1985-10-01), Kvaternik
patent: 4563640 (1986-01-01), Hasegawa
patent: 4567433 (1986-01-01), Ohkubo et al.
patent: 4585991 (1986-04-01), Reid et al.
patent: 4618820 (1986-10-01), Salvagno et al.
patent: 4626776 (1986-12-01), Wilkinson
patent: 4636723 (1987-01-01), Coffin

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