High density probe

Details High density probe High density probe

1990-02-26

1991-05-14

Wieder, Kenneth

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324 725, 324158P, 439 55, 439 72, G01R 102, G01R 104

Patent

active

050159461

ABSTRACT:
A high density probe for probing an integrated circuit package in situ on a circuit board has a probe body with a skirt that has alignment surfaces for mating with the package to provide an initial alignment. An alignment plate is elastically mounted within the probe housing internal of the skirt. The alignment plate has serrations between pin holes, the pin holes corresponding to probe pins elastically mounted on the probe housing in a pattern matching the leads of the integrated circuit package. When the probe is pressed down over the integrated circuit package the alignment surfaces within the skirt align the probe to the package, and the serrations mesh with the leads to align the probe pins with the leads, the probe pins extending through the pin holes and maintaining positive contact due to the elastic mounting of the pins. A base plate having a central aperture with comblike teeth extending into the aperture may first be placed over the integrated circuit package with the teeth meshing with the leads to provide a surface to mate with the alignment surfaces within the skirt.

REFERENCES:
patent: 3335327 (1967-08-01), Damon et al.
patent: 4349238 (1982-09-01), Showman et al.
patent: 4833404 (1989-05-01), Meyer et al.
"Super-Tester IC Flat Packs", by Azimuth Elect., 12/66, part #5124.
"IC Socket Takes Chip Carriers", by Electronics, 11/11/76, pp. 152 and 154.

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