Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1984-12-14
1988-07-12
Lusignan, Michael R.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
29846, 174 685, 427 98, 430312, 430313, 430315, B05D 512, G03C 500, H05K 100, H05K 302
Patent
active
047569298
ABSTRACT:
Densely packed high resolution printed wiring boards may be achieved by providing channels below grade in a substrate planar surface, thereby providing greater conductor width for closely spaced conductors. By mechanically removing the substrate surface between the channels, high virtual resolution is obtained with high quality conductors and insulation spacings of the order of about 0.003 inch, and with actual conductor widths of greater than 0.012 inch. Thus the packing density of printed wiring patterns may be increased significantly. Also the quality of conductor adherence and conductivity is improved. Thus a non-critical and inexpensive process unexpectedly provides an improved quality, more precise printed wiring pattern.
REFERENCES:
patent: 4374457 (1983-02-01), Wiech
patent: 4508753 (1985-04-01), Stepan
patent: 4521449 (1985-06-01), Arnold
patent: 4526810 (1985-07-01), Nesbitt
patent: 4528259 (1985-07-01), Sullivan
patent: 4532152 (1985-07-01), Elarde
Brown Laurence R.
Lusignan Michael R.
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