High density printing wiring

Details High density printing wiring High density printing wiring

1984-12-14

1988-07-12

Lusignan, Michael R.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29846, 174 685, 427 98, 430312, 430313, 430315, B05D 512, G03C 500, H05K 100, H05K 302

Patent

active

047569298

ABSTRACT:
Densely packed high resolution printed wiring boards may be achieved by providing channels below grade in a substrate planar surface, thereby providing greater conductor width for closely spaced conductors. By mechanically removing the substrate surface between the channels, high virtual resolution is obtained with high quality conductors and insulation spacings of the order of about 0.003 inch, and with actual conductor widths of greater than 0.012 inch. Thus the packing density of printed wiring patterns may be increased significantly. Also the quality of conductor adherence and conductivity is improved. Thus a non-critical and inexpensive process unexpectedly provides an improved quality, more precise printed wiring pattern.

REFERENCES:
patent: 4374457 (1983-02-01), Wiech
patent: 4508753 (1985-04-01), Stepan
patent: 4521449 (1985-06-01), Arnold
patent: 4526810 (1985-07-01), Nesbitt
patent: 4528259 (1985-07-01), Sullivan
patent: 4532152 (1985-07-01), Elarde

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