High density printed wiring board

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

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Details

156634, 156656, 1566611, 427 97, H05K 100

Patent

active

046634975

ABSTRACT:
Feed-through vias (38) of 8 mil and smaller diameter are placed on 25 mil centers or smaller so that the feed-through vias serve only as electrical connections and do not block channels between conductors (24a and 42a). The method for forming such feed-through vias and interconnections utilizes metallic resist (36 and 40) which covers the feed-through vias so that the metallic resist, along with conventional photoresist material, prevent undesired etching of the feed-through vias even in the event of misregistration of the photoresist material.

REFERENCES:
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patent: 3391457 (1968-07-01), Reimann
patent: 3464855 (1969-09-01), Shaheen et al.
patent: 3601523 (1971-08-01), Arndt
patent: 3791858 (1974-02-01), McPherson et al.
patent: 4131516 (1978-12-01), Bakos et al.
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4541035 (1985-09-01), Carlson et al.
patent: 4591411 (1986-05-01), Reimann
Funari, J., Metallized Multilayer Ceramic Packages with Welded I/O Pins, IBM Technical Disclosure Bulletin, vol. 21, No. 10, p. 3974, Mar. 79.
Baffaro L., Strippable Transmission Line, IBM Technical Disclosure Bulletin, vol. 8, No. 8, Jan. 1966, p. 1056.
Ellis, T. L., Injected Interconnections, IBM Disclosure Bulletin, vol. 11, No. 8, Jan. 1969, p. 992.
Greene, K. F., Producing Printed Circuit Boards, IBM Technical Disclosure Bulletin, vol. 11, No. 12, May 1969, p. 1676.

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