High-density printed circuit connector

Details High-density printed circuit connector High-density printed circuit connector

1993-04-02

1994-09-27

Abrams, Neil

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

439325, H01R 909, H01R 2370

Patent

active

053503198

ABSTRACT:
A connector for connecting flexible circuit conductors to contact pads of a PC board edge connector having a snap together housing of modular design having leaf springs used to resiliently bias the flexible circuits for contacting the pads, a slot for receiving the PC board edge connector, coil springs adjacent the slot for retaining the inserted PC board edge connector in the slot an alignment arrangement for alignment of the conductors and pads, protection for the free end regions of the flexible circuits and strain relief features, the connector being usable with conductors spaced 0.3 mm or less apart, and being easily assembled and disassembled.

REFERENCES:
patent: 3319216 (1967-05-01), McCullough
patent: 3941448 (1976-03-01), Evans
patent: 4172626 (1979-10-01), Olsson
patent: 4225205 (1980-09-01), Sinclair et al.
patent: 4227767 (1980-06-01), Mouissie
patent: 4509098 (1985-04-01), DasGupta et al.
patent: 4509099 (1985-04-01), Takamatsu et al.
patent: 4531793 (1985-07-01), Hochgesang
patent: 4581495 (1986-04-01), Geri et al.
patent: 4583800 (1986-04-01), Roberts et al.
patent: 4587596 (1986-05-01), Bunnell
patent: 4597617 (1986-07-01), Enochs
patent: 4602317 (1986-07-01), Rovnyak et al.
patent: 4621305 (1986-11-01), Daum
patent: 4740867 (1988-04-01), Roberts et al.
patent: 4969824 (1990-11-01), Casciotti
patent: 5080595 (1992-01-01), Mouissie
patent: 5156553 (1992-10-01), Katsumata et al.
Rice et al., Circuit Board Assembly, IBM Tech. Disc. Bull., vol. 4, #9, Feb. 1962, p. 7.
IBM Corp., Cable Connector, IBM Tech. Disc. Bull., vol. 28, #11, Apr. 1986, pp. 4989 & 4990.

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