High density power connector with impedance control

Details High density power connector with impedance control High density power connector with impedance control

2005-09-21

2009-12-01

Reichard, Dean A. (Department: 2841)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With mating connector which receives panel circuit edge

C361S752000, C174S262000

Reexamination Certificate

active

07625214

ABSTRACT:
A power connector assembly is provided that has high power density capability and controllable impedance. One embodiment has a multi-layer stack of printed circuit boards that each contain one or more metal layers that function selectively as power and return planes. The metal layers are electrically in contact with contact arrays of connectors, such as through half vias or slot vias for example, which mate with corresponding contact arrays of connectors associated with the circuits being connected together. Discrete components may be used to further control impedance of the connector. Different connector technologies may be used for connecting contacts to the metal layers.

REFERENCES:
patent: 4838798 (1989-06-01), Evans et al.
patent: 5167511 (1992-12-01), Krajewski et al.
patent: 2004/0085081 (2004-05-01), Logelin et al.
patent: 2006/0042831 (2006-03-01), Rohde et al.

Affiliated with

Also associated with

Rating

High density power connector with impedance control does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density power connector with impedance control, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density power connector with impedance control will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4077537