High density planar interconnected integrated circuit package

Details High density planar interconnected integrated circuit package High density planar interconnected integrated circuit package

1983-08-25

1985-11-12

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

339 17M, 339 75MP, 361400, H05K 114

Patent

active

045531927

ABSTRACT:
An integrated circuit module to printed circuit board interconnection system wherein the board has circuit pads to which spring contacts have one of their ends soldered to the pads. The module has circuit pads on one surface thereof and a pivotal connection is provided for loading the module onto the circuit board whereby the opposite ends of the spring contacts engage the circuit pads on the module with a wiping action and are retained in engagement therewith.

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IBM Technical Disclosure Bulletin, vol. 18, No. 3, Aug. 1975, p. 642, Full Semiconductor Wafer Package, R. H. A. Watson.
"Full Semiconductor Wafer Package", R. H. A. Watson, IBM Technical Disclosure Bulletin, vol. 18, No. 3, Aug. 1975, p. 642.
"High-Density Printed Circuit Connector, R. W. Callaway et al, IBM Technical Disclosure Bulletin, vol. 8, No. 3, Aug. 1965, pp. 351-352.

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