High density planar interconnected integrated circuit package

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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339 17M, 339 75MP, 361400, H05K 114

Patent

active

045531927

ABSTRACT:
An integrated circuit module to printed circuit board interconnection system wherein the board has circuit pads to which spring contacts have one of their ends soldered to the pads. The module has circuit pads on one surface thereof and a pivotal connection is provided for loading the module onto the circuit board whereby the opposite ends of the spring contacts engage the circuit pads on the module with a wiping action and are retained in engagement therewith.

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"High-Density Printed Circuit Connector, R. W. Callaway et al, IBM Technical Disclosure Bulletin, vol. 8, No. 3, Aug. 1965, pp. 351-352.

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