High density PCMCIA frame kit

Details High density PCMCIA frame kit High density PCMCIA frame kit

1995-05-17

1996-04-23

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361737, 361800, 361818, 361196, 174 35R, 257659, H05K 900

Patent

active

055109594

ABSTRACT:
This invention is directed to an improved PCMCIA frame kit for receiving a planar electronic device, such as a printed circuit board or memory card, for electrical engagement with a complementary device in electronic equipment, such as a computer. The kit comprises a pair of matable, cover members to provide shielding to the planar electronic device, and that each cover member is integrally molded to a dielectric frame upon which the planar electronic device is seated. The improvement hereof lies in the provision of each frame including a dielectric extension intermatable with one another to define a cavity for receiving a portion of the planar electronic device. By this arrangement the planar electronic device may be provided with an antenna for the transmission of signals through the dielectric extension. Optionally, the cover members and extensions may be essentially identical in construction having appropriate means about the periphery thereof, for intermatability. Further, an elastomeric sealing gasket may be provided between the shielding cover members and the respective extensions.

REFERENCES:
patent: 5153818 (1992-10-01), Mukougawa et al.
patent: 5242310 (1993-09-01), Leung
patent: 5335145 (1994-08-01), Kusui
patent: 5339222 (1994-08-01), Simmons et al.
patent: 5397857 (1995-03-01), Farquhar et al.
Branson Ultrasonics Corporation; "Designing Parts For Ultrasonic Welding"; Technical Information; 1975; Revised Apr. 1994.

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