High density parallel interconnect

Details High density parallel interconnect High density parallel interconnect

1992-04-02

1993-04-27

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439591, H01R 909

Patent

active

052057399

ABSTRACT:
A modified high density backplane (MHDB) connector is provided for electrically interconnecting high density printed circuit boards having predetermined interconnect circuitry including high density arrays of ground/signal contact pads, discrete power pads and discrete ground pads. The MHDB connector includes one or more contact modules, a connector housing, a pcb biasing mechanism, connector end caps, a flexible film, two interactive biasing modules for each contact module, and a camming member secured to the pcb to be mated. The interactive biasing modules contact with the flexible film to provide uniform contact force distribution over the interconnect regions of the connector and provide contact rivet displacement tolerance relief. The MHDB connector provides sequenced movement of the pcb to be mated into the contact rivets to provide contact wipe and may provide for alignment of the one pcb with the MHDB connector. The end caps provide for MHDB connector sealing and localized securement of the connector to the pcb. The power contact modules may include supply and return contacts and provide the capability for reconfiguring the MHDB connector for diverse applications. A parallel interconnect embodiment effects electrical engagement between two circuit boards disposed in parallel planes.

REFERENCES:
patent: 3715706 (1973-02-01), Michel et al.
patent: 3853382 (1974-12-01), Lazar
patent: 3924915 (1975-12-01), Conrad
patent: 4288140 (1981-09-01), Griffith et al.
patent: 4420203 (1983-12-01), Aug et al.
patent: 4517625 (1985-05-01), Frink et al.
patent: 4518210 (1985-05-01), Morrison
patent: 4538866 (1985-09-01), Johnson
patent: 4540227 (1985-09-01), Faraci
patent: 4540228 (1985-09-01), Steele
patent: 4552420 (1985-11-01), Eigenbrode
patent: 4585288 (1986-04-01), Aikens
patent: 4597619 (1986-07-01), Reimer
patent: 4629270 (1986-12-01), Andrews, Jr. et al.
patent: 4693530 (1987-09-01), Stillie et al.
patent: 4744764 (1988-05-01), Rubenstein
patent: 4795977 (1989-01-01), Frost et al.
patent: 4838798 (1989-06-01), Evans et al.
patent: 4838801 (1989-06-01), Bertogolio
patent: 4869676 (1989-09-01), Demler, Jr. et al.
patent: 4881901 (1989-11-01), Mendenhall et al.

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