High density para-aramid papers

Details High density para-aramid papers High density para-aramid papers

1985-09-17

1988-03-08

Pertilla, Theodore E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

162146, 1621573, 427411, 428323, 428338, P04H 158, D21H 512

Patent

active

047299215

ABSTRACT:
High density para-aramid papers comprising 5 to 25 percent, by weight, binder and an amount of para-aramid fibers selected from the group consisting of para-aramid pulp, para-aramid floc and mixtures thereof, compacted to provide a volume percent para-aramid fiber of at least 53 minus 0.13 times the volume percent floc in the paper are useful in the preparation of circuit board substrates having a low coefficient of thermal expansion.

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IBM Technical Disclosure Bulletin, vol. 20, No. 2, p. 555, (7/77).

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